The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Mar. 05, 2018
Industrial Technology Research Institute, Hsinchu, TW;
Intellectual Property Innovation Corporation, Hsinchu, TW;
Chen-Tsai Yang, Taoyuan, TW;
Ko-Chin Yang, Taipei, TW;
Jui-Chang Chuang, Kaohsiung, TW;
Yen-Ting Wu, Taoyuan, TW;
Chia-Hua Lu, Miaoli County, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Intellectual Property Innovation Corporation, Hsinchu, TW;
Abstract
A chip package structure includes a chip package layer and at least one conductive structure layer. The chip package layer includes at least one chip and an encapsulant. The chip has an upper surface, and the encapsulant is used to encapsulate the chip and expose the upper surface. The conductive structure layer includes a plurality of first conductive pillars and a plurality of second conductive pillars. The first conductive pillars are disposed on the upper surface, the second conductive pillars are disposed on the upper surface and located between an edge of the upper surface and the first conductive pillars. A density of the second conductive pillars along an extending direction of the edge is greater than or equal to 1.2 times of a density of the first conductive pillars along the extending direction of the edge.