Industrial Technology Research Institute

Intellectual Property Innovation Corporation

Chia-Hua Lu

Yen-Ting Wu

Chen-Tsai Yang

Jui-Chang Chuang

Ko-Chin Yang

A chip package structure includes a chip package layer and at least one conductive structure layer. The chip package layer includes at least one chip and an encapsulant. The chip has an upper surface, and the encapsulant is used to encapsulate the chip and expose the upper surface. The conductive structure layer includes a plurality of first conductive pillars and a plurality of second conductive pillars. The first conductive pillars are disposed on the upper surface, the second conductive pillars are disposed on the upper surface and located between an edge of the upper surface and the first conductive pillars. A density of the second conductive pillars along an extending direction of the edge is greater than or equal to 1.2 times of a density of the first conductive pillars along the extending direction of the edge.

Growing community of inventors

Miaoli County, Taiwan

Chia-Hua Lu