Hsinchu, Taiwan

Chia-Hsun Wu

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2023-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Hsun Wu. Retrieved from https://idiyas.com/inventor/chia-hsun-wu-owng6s8z

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2023-2024

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2 patents (USPTO):Explore Patents

Title: The Innovative Journey of Chia-Hsun Wu

Introduction: Chia-Hsun Wu, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Chia-Hsun Wu's latest patents include advancements in semiconductor technology, particularly in the development of next-generation microchips with enhanced processing capabilities.

Career Highlights: With a career spanning over two decades, Chia-Hsun Wu has held key positions in leading tech companies, where he spearheaded research and development projects that have revolutionized the industry.

Collaborations: Throughout his career, Chia-Hsun Wu has collaborated with top researchers, engineers, and scientists from renowned universities and research institutions worldwide, fostering a culture of innovation and excellence.

Conclusion: Chia-Hsun Wu's relentless pursuit of innovation and his commitment to pushing the boundaries of technology make him a true trailblazer in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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