Company Filing History:
Years Active: 2009-2013
Title: Innovations of Chia-Hsiun Yu
Introduction
Chia-Hsiun Yu is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor fabrication, holding a total of 2 patents. His work focuses on innovative methods for creating openings and structures in semiconductor materials.
Latest Patents
Chia-Hsiun Yu's latest patents include a "Method for Fabricating Opening" and a "Method for Fabricating Single-Damascene Structure, Dual Damascene Structure, and Opening Thereof." The first patent provides a fabrication method that involves a substrate with a conductive region, where a dielectric layer is formed over it. A stacked layer is then created, which includes a patterned metal hard mask layer, a patterned silicon oxynitride layer, and a patterned silicon oxide layer. This method allows for the formation of an opening that exposes the conductive region. The second patent describes a method for fabricating a single-damascene opening, detailing the sequential formation of various layers on a substrate and the removal processes that lead to the creation of a damascene opening.
Career Highlights
Chia-Hsiun Yu is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His expertise in fabrication methods has contributed to advancements in semiconductor technology.
Collaborations
Chia-Hsiun Yu collaborates with Ming-Hsing Liu, a fellow professional in the field. Their combined efforts enhance the innovative capabilities within their projects.
Conclusion
Chia-Hsiun Yu's contributions to semiconductor fabrication through his patents demonstrate his commitment to innovation in technology. His work continues to influence the industry positively.