Chia-Ho Tsai

Title: Chia-Ho Tsai: Innovator in Extreme Ultraviolet Lithography

Introduction

Chia-Ho Tsai is a prominent inventor based in Hillsboro, OR (US). He has made significant contributions to the field of semiconductor technology, particularly in extreme ultraviolet (EUV) lithography. His innovative work has implications for the development of advanced integrated circuits and transistor structures.

Latest Patents

Chia-Ho Tsai holds a patent for "Extreme ultraviolet lithography patterning with assist features." This patent discloses techniques for improved EUV patterning using assist features, which enhance the coverage of absorber material in the EUV mask. The method involves patterning a number of semiconductor fins and assist features into a semiconductor substrate using EUV. The assist features play a crucial role in reducing bright field defects in the EUV patterning process. Ultimately, the protected active fins are utilized in transistor devices, showcasing the practical applications of his invention.

Career Highlights

Chia-Ho Tsai is currently employed at Intel Corporation, where he continues to push the boundaries of semiconductor technology. His work is instrumental in advancing the capabilities of EUV lithography, which is essential for the production of smaller and more efficient semiconductor devices.

Collaborations

Chia-Ho Tsai has collaborated with notable colleagues, including Leonard P. Guler and Tahir Ghani. These partnerships have fostered an environment of innovation and have contributed to the success of their projects in the semiconductor industry.

Conclusion

Chia-Ho Tsai's contributions to extreme ultraviolet lithography represent a significant advancement in semiconductor technology. His innovative techniques are paving the way for the future of integrated circuits and transistor devices.