This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2017.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2017
Title: Chia-Haw Yeh: Innovator in Wafer Taping Technology
Introduction
Chia-Haw Yeh is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly through his innovative patent related to wafer taping technology. His work is essential in enhancing the efficiency and precision of semiconductor production processes.
Latest Patents
Chia-Haw Yeh holds a patent for a "Device and method for wafer taping." This invention includes a wafer taping device that features a tape delivering mechanism along a first direction. The device also comprises a wafer mount unit positioned below the tape, which supports a wafer and includes a notch for aligning a cut mark of the wafer. The notch is staggered in a second direction that is perpendicular to the first direction. Additionally, the device incorporates a laminating roller above the wafer mount unit, designed to press the tape onto the wafer by reciprocating along the first direction. This innovative design improves the efficiency of the wafer taping process.
Career Highlights
Chia-Haw Yeh is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role involves developing advanced technologies that contribute to the company's reputation for excellence in manufacturing. His patent reflects his commitment to innovation and quality in semiconductor production.
Collaborations
Chia-Haw Yeh has collaborated with notable colleagues, including Chih-Yang Chan and Yuh-Sen Chang. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and advancements in technology.
Conclusion
Chia-Haw Yeh's contributions to wafer taping technology exemplify his innovative spirit and dedication to the semiconductor industry. His patent not only enhances manufacturing processes but also showcases the importance of collaboration in driving technological advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile