Taoyuan, Taiwan

Chia-Fang Tsai

This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2014-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Fang Tsai. Retrieved from https://idiyas.com/inventor/chia-fang-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2014-2017

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2 patents (USPTO):Explore Patents

Title: Innovations by Chia-Fang Tsai

Introduction

Chia-Fang Tsai is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of integrated circuits. With a total of 2 patents to his name, Tsai's work focuses on improving the efficiency and reliability of metal contacts in semiconductor devices.

Latest Patents

Tsai's latest patents include innovative methods for forming back-end-of-the-line metal contacts. One of his patents, titled "Protruding contact for integrated chip," describes a method that eliminates RC opens caused by metal dishing during chemical mechanical polishing. This method involves depositing a sacrificial UV/thermal decomposition layer (UTDL) above an inter-level dielectric (ILD) layer. A metal contact is formed that extends through the ILD layer and the sacrificial UTDL. A chemical mechanical polishing (CMP) process is then performed to generate a planar surface comprising the sacrificial UTDL. Finally, the sacrificial UTDL is removed through ultraviolet exposure or thermal anneal, allowing the metal contact to protrude from the ILD layer.

Another patent, "Process to achieve contact protrusion for single damascene via," outlines a similar method aimed at enhancing the reliability of metal contacts in semiconductor applications. This patent also emphasizes the importance of the CMP process and the removal of the sacrificial layer to achieve the desired contact protrusion.

Career Highlights

Chia-Fang Tsai is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at TSMC has allowed him to collaborate with some of the brightest minds in the field, contributing to advancements in semiconductor manufacturing processes.

Collaborations

One of Tsai's notable coworkers is Hsin-Hsien Lu. Their collaboration has likely fostered innovative ideas and solutions in semiconductor technology, further enhancing the capabilities of their team at TSMC.

Conclusion

Chia-Fang Tsai's contributions to semiconductor technology through his patents demonstrate his commitment to innovation and excellence in the field. His work continues to influence the development of more efficient and reliable semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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