Location History:
- Changhau City, TW (1993)
- Changhua City, TW (1995 - 1997)
- Wai Pu Hsian, Taichung Hsien, TW (2002)
- Da-Li City, Taichung county, TW (2007)
- Kaohsiung County, TW (2009)
- Kaohsiung, TW (2007 - 2018)
Company Filing History:
7 out of 1,874 
3 out of 191 
7 out of 832,891 Years Active: 1993-2018
Title: Innovator Spotlight: Chia-Ching Chen and His Contributions to Semiconductor Technology
Introduction: Chia-Ching Chen is a distinguished inventor based in Kaohsiung, Taiwan. With an impressive portfolio of 17 patents, he has made significant contributions to the field of semiconductor technology. His latest inventions not only reflect his innovative mindset but also address critical challenges within the industry.
Latest Patents: Among Chia-Ching Chen's recent patents is a groundbreaking design for a semiconductor substrate and semiconductor package structure. This structure integrates a substrate, a semiconductor chip, and a solder material. The substrate features an insulating layer, a conductive circuit layer, and a conductive bump. The conductive circuit layer is thoughtfully recessed from the top surface of the insulating layer, incorporating a pad that extends along the side surface of the insulating layer. Importantly, the conductive bump is positioned on the pad, creating an accommodating space defined by the interaction of the bump, pad, and insulating layer. The innovative solder material provides electrical connectivity between the bump and the semiconductor chip, with a portion residing within the accommodating space, enhancing performance.
Additionally, Chen has developed an interposer substrate along with semiconductor structures and associated fabrication processes. This design focuses on warpage control within semiconductor package structures. The interposer substrate includes a cavity and a reinforcement structure, which is cleverly utilized to manage warpage effectively, thereby optimizing the reliability and performance of semiconductor devices.
Career Highlights: Throughout his career, Chia-Ching Chen has been associated with leading companies in the semiconductor industry, including Advanced Semiconductor Engineering, Inc. His expertise and visionary approach have solidified his reputation as a leader in semiconductor innovation.
Collaborations: Collaboration is a backbone of innovation, and Chen has had the privilege of working alongside talented individuals such as Yi-Chuan Ding and Kuo-Feng Huang. Their collective efforts have paved the way for advancements in semiconductor technologies and have contributed to the successful realization of complex engineering solutions.
Conclusion: Chia-Ching Chen exemplifies the spirit of innovation through his extensive patent portfolio and commitment to advancing semiconductor technology. As he continues to push boundaries and develop pioneering solutions, his contributions will undoubtedly leave a lasting impact in the field of electronics and beyond.