Other

Advanced Semiconductor Engineering, Inc.

Kwang Yang Motor Co., Ltd.

Chia-Ching Chen

Yi-Chuan Ding

Kuo-Feng Huang

Guo-Cheng Liao

Jung-Chung Chen

Chin-Li Kao

Cheng-Wei Lin

Tang-Yuan Chen

Wei-Hong Lai

Hung-Jen Chang

Show-Jane Yen

Yue-Shi Lee

A semiconductor package structure includes a substrate, a semiconductor chip, and a solder material. The substrate includes an insulating layer, a conductive circuit layer, and a conductive bump. The conductive circuit layer is recessed from a top surface of the insulating layer. The conductive circuit layer includes a pad, and a side surface of the pad extends along a side surface of the insulating layer. The conductive bump is disposed on the pad. A side surface of the conductive bump, a top surface of the pad and the side surface of the insulating layer together define an accommodating space. A solder material electrically connects the conductive bump and the semiconductor chip. A portion of the solder material is disposed in the accommodating space.

Semiconductor substrate and semiconductor package structure having the same

Described herein are interposer substrate designs for warpage control, semiconductor structures including said interposer substrates, and fabricating processes thereof. An interposer substrate defines a cavity and further includes a reinforcement structure, wherein the reinforcement structure is used to control warpage of the semiconductor package structure.

Interposer substrate, semiconductor structure and fabricating process thereof

The present disclosure relates to a semiconductor package structure including a semiconductor substrate, a semiconductor chip and a conductive material. The semiconductor substrate includes an insulating layer, a conductive circuit layer and a conductive bump. The conductive circuit layer is recessed from the top surface of the insulating layer, and includes at least one pad. The conductive bump is disposed on the at least one pad. A side surface of the conductive bump, a top surface of the at least one pad and a side surface of the insulating layer together define an accommodating space. The conductive material is electrically connected the conductive bump and the semiconductor chip, and a portion of the conductive material is disposed in the accommodating space.

A semiconductor package includes a set of stud bumps, which can be formed by wire bonding technology and can be bonded or joined to a semiconductor element to form a stacked package assembly. Since the process of bonding the semiconductor element to the stud bumps can be carried out without reflow, an undesirable deformation resulting from high temperatures can be controlled or reduced.

Stackable semiconductor package and manufacturing method thereof

The present invention discloses a fast algorithm for mining high utility itemsets, wherein some transaction data and item utilities are recorded in a tree structure. The method to construct a tree structure is recording on a node the item utilities appearing from the root node to the node. Some techniques are used to reduce the mining space, whereby the fast algorithm can directly generate high utility itemsets from the tree structure without generating any candidates. The fast algorithm of the present invention is more efficient than the existing highest-efficiency algorithm. The present invention further proposes a compression method to effectively save memory space.

Fast algorithm for mining high utility itemsets

An embodiment of a semiconductor device package includes: (1) an interconnection unit including a patterned conductive layer; (2) an electrical interconnect extending substantially vertically from the conductive layer; (3) a semiconductor device adjacent to the interconnection unit and electrically connected to the conductive layer; (4) a package body: (a) substantially covering an upper surface of the interconnection unit and the device; and (b) defining an opening adjacent to an upper surface of the package body and exposing an upper surface of the interconnect; and (5) a connecting element electrically connected to the device, substantially filling the opening, and being exposed at an external periphery of the device package. The upper surface of the interconnect defines a first plane above a second plane defined by at least a portion of the upper surface of the interconnection unit, and below a third plane defined by the upper surface of the package body.

Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof

Semiconductor package including a stacking element

Described herein are wafer-level semiconductor device packages with stacking functionality and related stacked package assemblies and methods. In one embodiment, a semiconductor device package includes a set of connecting elements disposed adjacent to a periphery of a set of stacked semiconductor devices. At least one of the connecting elements is wire-bonded to an active surface of an upper one of the stacked semiconductor devices.

Semiconductor device packages including connecting elements

Scooter

Motorcycle

Provided is a floss dispenser comprises a housing defining at least a receiving chamber with a floss bobbin rotationally received therein. A floss fork is arranged at an end of the housing for bracing a section of floss thereon. A first tension-controlling device is arranged on the housing controlling a tension of the floss after the floss fork. And a tensioner is arranged adjacent to the feeding device controlling the tension between the floss bobbin and the floss fork. By the provision of the tensioner, the tension of the floss can be properly controlled during the flossing process, and the tension of the floss can be released after the flossing process.

Floss dispenser with dynamic tension control

A support frame is intended to support the decorative sheet product and is formed of a plurality of longitudinal elements and horizontal elements, which are in turn formed of a plurality of base portions and main bodies. The base portions are provided with a protrusion and a recess opposite in location to the protrusion, and two slots opposite in location to each other. The base portions are joined together by the mortise-tenon joints to form the longitudinal elements. The main bodies are provided with two protruded blocks opposite in location to each other and are arranged in alignment such that the protruded blocks are received in the slots of the base portions of the longitudinal elements, and that the main bodies form the horizontal elements perpendicular to the longitudinal elements.

Support frame of sheet product

A fastening device is capable of holding securely the head tube and the handlebar sleeve in the front fork of a bicycle. The front fork is provided respectively at both upper end thereof and lower end thereof with a restraining ring which is of an arcuate construction and is capable of bringing about an automatic calibration so as to ensure that the bearing sets of the front fork cooperate properly and rotate smoothly.

Two-step and toothless bicycle head shaft bowl set

A two-step and toothless bicycle head shaft bowl set has a two-step locking device making use of two semi-cylindrical members and an upper cover provided with a fastening bolt. The two semi-cylindrical members can be caused to effect the fastening by tightening the fastening bolt of the upper cover. The two-step locking device is capable of effecting an automatic alignment of centers of the component parts of the device in conjunction with arcuate lashing rings. The two-step locking device can also be used to enable the bearings to be positioned at an optimum horizontal angle so as to ensure a smooth rotation of the bearings and to eliminate the gap between two component parts.

Growing community of inventors

Kaohsiung, Taiwan

Chia-Ching Chen