This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2006.
Company Filing History:
Years Active: 2006
Title: Chi-Weng Chung: Innovator in Chemical Mechanical Polishing
Introduction
Chi-Weng Chung is a notable inventor based in Douliou, Taiwan. He has made significant contributions to the field of chemical mechanical polishing (CMP), particularly in improving the uniformity of polishing processes. His innovative approach has implications for various applications in semiconductor manufacturing.
Latest Patents
Chi-Weng Chung holds a patent titled "Method for achieving uniform CU CMP polishing." This patent describes a method for removing a metal oxide overlayer from a target polishing surface during a CMP process. The process aims to enhance polishing uniformity by utilizing an oxide removal solution before performing the CMP with an abrasive slurry. This method includes polishing the target surface with a slurry that contains at least one oxidizer and a complexing agent. He has 1 patent to his name.
Career Highlights
Chi-Weng Chung is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work focuses on advancing CMP techniques, which are crucial for the production of high-quality semiconductor devices. His expertise in this area has positioned him as a valuable asset to his team and the industry.
Collaborations
Chi-Weng Chung has collaborated with several professionals in his field, including Sa-Na Lee and Tsu Shih. These collaborations have fostered innovation and contributed to the development of effective CMP solutions.
Conclusion
Chi-Weng Chung's contributions to the field of chemical mechanical polishing demonstrate his commitment to innovation and excellence. His patent and work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as a key figure in advancing semiconductor manufacturing processes.