Company Filing History:
Years Active: 2006-2015
Title: Innovations by Chi-Wen Chang
Introduction
Chi-Wen Chang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding two patents that showcase his innovative designs. His work is primarily associated with Advanced Semiconductor Engineering, Inc., where he continues to push the boundaries of technology.
Latest Patents
Chi-Wen Chang's latest patents include advancements in quad flat non-leaded packages. The first patent describes a quad flat non-leaded package that features a leadframe, a chip, a plurality of first bonding wires, and a molding compound. This design includes a leadframe with multiple first leads, where each lead has a first portion and a second portion extending along an axis. The first portion is longer and thicker than the second portion, allowing for efficient electrical connections between the chip and the leads. The molding compound encapsulates the leadframe, chip, and bonding wires, ensuring durability and reliability.
The second patent also pertains to a quad flat non-leaded package, which comprises a lead frame, a semiconductor chip, connecting wires, and a molding compound. In this design, the lead frame includes a die pad, supporting bars, and an external ring that enhances support for the semiconductor chip. The semiconductor chip is larger than the die pad and is attached through its active surface. The molding compound encapsulates the entire assembly, with parts of the leads exposed for external connections.
Career Highlights
Chi-Wen Chang has established himself as a key figure in semiconductor innovation. His work at Advanced Semiconductor Engineering, Inc. has led to advancements that improve the performance and reliability of electronic devices. His patents reflect a deep understanding of the technical requirements in semiconductor packaging.
Collaborations
Chi-Wen Chang collaborates with talented individuals such as Su Tao and Yueh-Liang Hsu, who contribute to the innovative environment at Advanced Semiconductor Engineering, Inc. Their teamwork fosters creativity and drives the development of cutting-edge technologies.
Conclusion
Chi-Wen Chang's contributions to semiconductor packaging through his patents demonstrate his commitment to innovation. His work not only enhances the functionality of electronic devices but also sets a standard for future developments in the industry.