The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2015
Filed:
Oct. 14, 2009
Yueh-liang Hsu, Taichung, TW;
Chi-wen Chang, Kaohsiung, TW;
Yueh-Liang Hsu, Taichung, TW;
Chi-Wen Chang, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A quad flat non-leaded package including a leadframe, a chip, a plurality of first bonding wires and a molding compound is provided. The leadframe includes a plurality of first leads, and each first lead has a first portion and a second portion that extend along an axis. The length of the first portion is greater than the length of the second portion. The thickness of the first portion is greater than the thickness of the second portion. The chip is disposed on the leadframe and covers a portion of the first portions. The first bonding wires are connected between the chip and another portion of the first portions or the chip and the second portions, such that the chip is electrically connected to the first leads through the first bonding wires. The molding compound encapsulates a portion of the first leads, the chip and the first bonding wires.