Chi-Wei Liao is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of optoelectronics, holding a total of 10 patents. His work focuses on developing advanced technologies that enhance the functionality and efficiency of light-emitting devices.

Latest Patents

Among his latest patents is a "Light-emitting element package and fabrication method thereof." This innovative method involves providing a high precision wafer level mold module, which includes an upper mold and a bottom mold. The process entails mounting a substrate with multiple light-emitting elements between these molds, filling package materials into the mold module, and subsequently removing the module to obtain the final package members. Another notable patent is the "Traffic light assembly," which features at least one light module and lens, enclosed within a housing. This assembly includes a foldable cover that is equipped with a cleaning device to remove snow and dust from its surface, ensuring optimal visibility and functionality.

Career Highlights

Chi-Wei Liao is currently employed at Advanced Optoelectronic Technology, Inc., where he continues to push the boundaries of innovation in optoelectronic technologies. His work has not only advanced the field but has also contributed to the development of practical applications that benefit society.

Collaborations

Chi-Wei has collaborated with notable colleagues, including Chih-Yung Lin and Min-Tsun Hsieh. Their combined expertise has fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Chi-Wei Liao's contributions to the field of optoelectronics through his patents and collaborative efforts highlight his role as a leading inventor. His innovative solutions continue to shape the future of light-emitting technologies.

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