The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Aug. 22, 2013
Advanced Optoelectronic Technology, Inc., Hsinchu Hsien, TW;
Min-Tsun Hsieh, Hsinchu, TW;
Wen-Liang Tseng, Hsinchu, TW;
Lung-Hsin Chen, Hsinchu, TW;
Chih-Yung Lin, Hsinchu, TW;
Ching-Lien Yeh, Hsinchu, TW;
Chi-Wei Liao, Hsinchu, TW;
Advanced Optoelectronic Technology, Inc., Hsinchu Hsien, TW;
Abstract
A fabrication method for a light-emitting element package, the method comprising: providing a high precision wafer level mold module, the high precision wafer level mold module comprising an upper mold and a bottom mold; mounting a substrate with a plurality of light-emitting elements between the upper mold and the bottom mold; filling package materials into the high precision wafer level mold module to obtain package members mounted on the light-emitting elements; and removing the high precision wafer level mold module.