Location History:
- Douliou, TW (2004)
- Yunlin, TW (2005)
Company Filing History:
Years Active: 2004-2005
Title: Innovations of Chi-Wei Chung in Chemical Mechanical Polishing
Introduction
Chi-Wei Chung is a notable inventor based in Yunlin, Taiwan. He has made significant contributions to the field of chemical mechanical polishing (CMP), particularly in processes that enhance the efficiency and effectiveness of semiconductor manufacturing. With a total of 2 patents, his work has been instrumental in reducing defects and improving the quality of polished surfaces.
Latest Patents
Chi-Wei Chung's latest patents include a novel chemical mechanical polishing process that significantly reduces defects in copper processing. This innovative oxide polishing process involves a key sequence at a third polishing station, where a first oxide slurry is applied, followed by a DI water rinse, and then a second oxide slurry with another rinse. This method has proven to reduce defect counts from several thousand to less than 100. Additionally, the process utilizes a low down force to enhance particle removal efficiency. His second patent describes a chemical mechanical polishing apparatus equipped with a chilled retaining ring. This apparatus features a heat transfer mechanism that circulates a heat-exchanging fluid, effectively reducing the temperature of the slurry solution that contacts the wafer. This innovation addresses delamination issues for low k dielectric materials and minimizes wafer scratching during polishing.
Career Highlights
Chi-Wei Chung is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to develop and refine CMP technologies. His expertise in this area has made him a valuable asset to the company and the semiconductor industry as a whole.
Collaborations
Chi-Wei has collaborated with notable colleagues such as Syun-Ming Jang and William Weilun Hong, contributing to advancements in CMP processes and technologies.
Conclusion
Chi-Wei Chung's innovative work in chemical mechanical polishing has led to significant improvements in semiconductor manufacturing processes. His patents reflect a commitment to enhancing efficiency and reducing defects, making a lasting impact on the industry.