Chi-Te Chin

Title: Chi-Te Chin: Innovator in Thermal Conductivity

Introduction

Chi-Te Chin is an accomplished inventor based in Hsinchu, Taiwan, known for his contributions to the field of thermal conductivity. With a total of three patents to his name, Chin's work focuses on advanced methods and equipment that enhance the efficiency of heat conduction processes.

Latest Patents

Chi-Te Chin's latest patents showcase his innovative approach to heat conduction technologies. The first patent, titled "Method and equipment of making a length of heat conduction pipe in a vacuum environment from a semi-finished heat conduction pipe," describes a sophisticated process involving the preparation, squelching, and sealing of long heat conduction pipes in a vacuum. This method enhances the integrity and performance of thermal conduction applications.

His second patent, "Measuring system and screening method for thermal conductive efficiencies of thermal conductive devices," introduces a unique measuring system that generates a temperature differential to assess the thermal conductive capabilities of devices. This technique allows for rapid determination of maximum thermal conductive quantities, thus enabling improved screening of thermal conductive efficiencies.

Career Highlights

Throughout his career, Chi-Te Chin has made significant strides in the technology sector, particularly during his tenure at Yeh-Chiang Technology Corporation and Zhongshan Weiqiang Technology Co., Ltd. His efforts in these organizations have bolstered advancements in thermal management solutions.

Collaborations

In his professional journey, Chin has collaborated with notable colleagues, including Chih-Sheng Wang and Ke-Chin Lee, a talented female engineer. Their combined expertise has contributed to the successful development of cutting-edge thermal conduction technologies.

Conclusion

Chi-Te Chin's innovative work in the realm of thermal conductivity is significant, with a focus on practical applications that drive efficiency and performance. As he continues to explore new avenues in invention and technology, his contributions are expected to influence future developments in heat conduction systems and devices.