The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2009

Filed:

Dec. 22, 2005
Applicants:

Ke-chin Lee, Taoyuan County, TW;

Chen-chuan Lin, Taoyuan County, TW;

Chi-te Chin, Hsinchu, TW;

Li-kai Wu, Taoyuan County, TW;

Inventors:

Ke-Chin Lee, Taoyuan County, TW;

Chen-Chuan Lin, Taoyuan County, TW;

Chi-Te Chin, Hsinchu, TW;

Li-Kai Wu, Taoyuan County, TW;

Assignee:

Yeh-Chiang Technology Corp., Yangmei Town, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 25/18 (2006.01); G01N 25/20 (2006.01); G01K 17/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

The measuring system generates a temperature difference between a heating terminal and a terminal conductive device by setting the temperature of a metal heated block at the heating terminal and the temperature of a heat dissipating water jacket at a heat dissipating terminal, and judges the thermal conductive capability of the thermal conductive device by comparing the cooling speed of the metal heating bock to obtain a relative power value according to the variation of heat quantity of the metal heated block in practical temperature reduction process. The maximum thermal conductive quantity (Qmax value) of the thermal conductive device can be rapidly obtained by parameter conversion with respect to the maximum power value. In the case of confirming the cooling curve (cooling speed) of a standard sample, the object of screening the thermal conductive efficiencies of the thermal conductive devices can be achieved by using the cooling curve.


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