Company Filing History:

16 out of 164,108

International Business Machines Corporation

Years Active: 1976-2008

where 'Filed Patents' based on already Granted Patents

18 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 7374811 - Probe pad structure in a ceramic space transformer (2008-05-20),

2. 7227268 - Placement of sacrificial solder balls underneath the PBGA substrate (2007-06-05),

3. 6829149 - Placement of sacrificial solder balls underneath the PBGA substrate (2004-12-07),

4. 6353182 - Proper choice of the encapsulant volumetric CTE for different PGBA substrates (2002-03-05),

5. 6255599 - Relocating the neutral plane in a PBGA substrate to eliminate chip crack and interfacial delamination (2001-07-03),

6. 6188305 - Transformer formed in conjunction with printed circuit board (2001-02-13),

7. 6000130 - Process for making planar redistribution structure (1999-12-14),

8. 5959348 - Construction of PBGA substrate for flip chip packing (1999-09-28),

9. 5774340 - Planar redistribution structure and printed wiring device (1998-06-30),

10. 5684392 - System for extending operating time of a battery-operated electronic (1997-11-04),

11. 5546321 - Method and apparatus for the cross-sectional design of multi-layer (1996-08-13),

12. 5519633 - Method and apparatus for the cross-sectional design of multi-layer (1996-05-21),

13. 5248262 - High density connector (1993-09-28),

14. 5191174 - High density circuit board and method of making same (1993-03-02),

15. T106201 - Master image chip organization technique or method (1986-03-03),

Title: The Innovative Contributions of Chi Shih Chang

Introduction

Chi Shih Chang is a prominent inventor based in Austin, TX, known for his significant contributions to the field of ceramic devices and packaging technologies. With a total of 18 patents to his name, Chang has made remarkable advancements that enhance the reliability and performance of electronic components.

Latest Patents

One of his latest patents is focused on a probe pad structure in a ceramic space transformer. This invention provides a method for manufacturing a ceramic device that includes a ceramic layer and a polyimide layer. The polyimide layer contains a plurality of copper vias, each in physical contact with the ceramic layer. The design ensures that the pads formed on the polyimide layer are supported by a continuous copper arrangement, offering greater mechanical strength compared to traditional methods.

Another notable patent involves the placement of sacrificial solder balls underneath the PBGA substrate. This invention improves the reliability of flip packages that utilize underfill encapsulation. It describes methods for relocating the neutral plane of the package substrate and arranging the layers of a laminate based on their stiffness. These innovations aim to enhance the overall performance and durability of flip chip packaging.

Career Highlights

Chi Shih Chang has worked with renowned companies such as IBM and Sematech, Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to the advancement of technology in the electronics industry.

Collaborations

Throughout his career, Chang has collaborated with notable individuals, including William T Chen and Ajit Kumar Trivedi. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Chi Shih Chang's contributions to the field of electronics through his patents and collaborations highlight his role as a leading inventor. His work continues to influence the industry, paving the way for future innovations.

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