Chi-Ping Chen

Title: Innovations by Chi-Ping Chen in Semiconductor Technology

Introduction

Chi-Ping Chen is a notable inventor based in Hsin-chu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of aluminum bonding pads. His innovative approaches have led to advancements that enhance the reliability of integrated circuit chips.

Latest Patents

Chi-Ping Chen holds a patent for a process aimed at preventing corrosion of aluminum bonding pads. The patent describes a method for etching access openings to aluminum alloy wire bonding pads of integrated circuit chips. This method involves the in-situ deposition of a polymer layer into the opening after the bonding pad has been exposed by dry etching of a passivation layer. The process begins with the etching of the passivation layer using fluorocarbon etchants, followed by the removal of a TiN ARC layer from the aluminum bonding pad. The etchants used may contain chlorine, which can leave behind non-volatile residues that cause corrosion when exposed to moisture. The polymer layer serves as a temporary seal, protecting the aluminum bonding pad during subsequent processing steps.

Career Highlights

Chi-Ping Chen is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in developing methods that improve the durability and performance of semiconductor devices.

Collaborations

Chi-Ping Chen has collaborated with notable colleagues, including Fang-Jen Hsu and Chen-Peng Fan. Their combined expertise has contributed to advancements in semiconductor technology.

Conclusion

Chi-Ping Chen's innovative work in semiconductor technology, particularly regarding aluminum bonding pads, showcases his commitment to enhancing the reliability of integrated circuits. His contributions continue to influence the field positively.