Chi-Jung Song

Title: Innovations of Chi-Jung Song in Semiconductor Packaging

Introduction

Chi-Jung Song is a prominent inventor based in Daejeon, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 7 patents. His work focuses on enhancing the efficiency and reliability of semiconductor devices, which are crucial in modern electronics.

Latest Patents

One of his latest patents is an area array type semiconductor package fabrication method. This innovation includes a plurality of conductive media, such as solder bumps or solder balls, attached to respective bond pads of a chip. These conductive media serve as external output terminals. The chip is affixed to a lead frame using a thermal conductive adhesive, and a predetermined area of both the lead frame and the semiconductor chip is encapsulated with a molding resin. The leads of the lead frame are then trimmed and shaped to allow the lead frame, to which the semiconductor chip is adhered, to function as a heat sink. This design enables the package to be utilized for high-powered semiconductor devices that emit significant heat. Additionally, the use of conductive media allows for a minimized package size, simplifies the arrangement of bonding pads on the chip, and enhances the electrical characteristics of the semiconductor package.

Another notable patent is for a semiconductor substrate and land grid array semiconductor package, which includes an insulation body with multiple first conductive interconnections embedded within it. A cavity is formed in the upper portion of the insulation body, and various conductive interconnection patterns are established both inside and outside the cavity. This design improves heat discharge efficiency and enhances solder joint reliability, making it a valuable advancement in semiconductor packaging technology.

Career Highlights

Chi-Jung Song has worked with notable companies in the semiconductor industry, including Hyundai Electronics Industries Co., Ltd. and LG Semicon Co., Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Throughout his career, Chi-Jung Song has collaborated with various professionals, including his coworker Seong-Jae Heo. These collaborations have further enriched his work and led to advancements in semiconductor packaging.

Conclusion

Chi-Jung Song's contributions to semiconductor packaging through his innovative patents have significantly impacted the electronics industry. His work continues to pave the way for advancements in high-powered semiconductor devices, ensuring improved performance and reliability.