The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2006
Filed:
Oct. 05, 2001
Chi-jung Song, Daejon, KR;
Chi-Jung Song, Daejon, KR;
Hyundai Electronics Industries Co., Ltd., Ichon, KR;
Abstract
An area array type semiconductor package includes a plurality of conductive media such as solder bumps or solder balls, attached to respective bond pads of a chip. The conductive media act as external output terminals. The chip is attached to a lead frame by a thermal conductive adhesive, and a predetermined area of the lead frame and the semiconductor chip are packaged with a molding resin. Leads of the lead frame are then trimmed and formed so that the lead frame, to which the semiconductor chip is adhered, acts as a heat sink. This allows the package to be used for a high-powered semiconductor device which radiates a high temperature heat. Also, because conductive media such as solder bumps or solder balls can be used to directly connect bond pads of the chip to conductive regions of a circuit board, a size of the semiconductor package can be minimized, the arrangement of the bonding pads on the chip can be easily planned, and electrical characteristics of the semiconductor package can be improved.