The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2004
Filed:
May. 30, 2002
Chi-Jung Song, Daejon, KR;
Hyundai Electromics Industries Co., Ltd., Ichon, KR;
Abstract
A land grid array (LGA) type semiconductor chip package includes an insulation body having a plurality of first conductive interconnections embedded therein. A cavity is formed in an upper portion of the insulation body. A plurality of first conductive interconnection patterns is formed outside the cavity and on marginal upper surfaces of the insulation body, and a plurality of second conductive interconnection patterns is formed on marginal lower surfaces of the insulation body. A plurality of third conductive interconnection patterns electrically connects the first and second conductive interconnection patterns, and a plurality of conductive bond pads is formed on a bottom of the cavity. A semiconductor chip is attached on the respective bond pads by a first adhesive member and a heat discharge member is attached by a second adhesive member on an upper surface of the semiconductor chip. An epoxy molding compound fills the cavity. The semiconductor package of the preferred embodiment enhances heat discharge efficiency and improves solder joint reliability.