Chi-Jung Lin

Title: Chi-Jung Lin: Innovator in Semiconductor Technology

Introduction

Chi-Jung Lin is a prominent inventor based in Changhua, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent that addresses critical challenges in the industry.

Latest Patents

Chi-Jung Lin holds a patent titled "Method for preventing aluminum intrusions." This invention involves a semiconductor wafer that includes a substrate, an aluminum layer on the substrate, an anti-reflection coating on the aluminum layer, a dielectric layer on the anti-reflection coating, and a via hole that passes through the dielectric layer and the anti-reflection coating down to a predetermined depth within the aluminum layer. A titanium layer is formed on the bottom and on the walls of the via hole. A physical vapor deposition process is then performed to form a first titanium nitride layer on the titanium layer. Subsequently, a chemical vapor deposition process is performed to form a second titanium nitride layer on the first titanium nitride layer. This innovative approach enhances the performance and reliability of semiconductor devices.

Career Highlights

Chi-Jung Lin is associated with United Microelectronics Corporation, a leading company in the semiconductor industry. His work at this organization has allowed him to develop and refine his inventions, contributing to advancements in semiconductor technology.

Collaborations

Chi-Jung Lin has collaborated with notable colleagues, including Jyh-J Huang and Horng-Bor Lu. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Chi-Jung Lin's contributions to semiconductor technology through his patent demonstrate his commitment to innovation in the field. His work not only addresses existing challenges but also paves the way for future advancements in semiconductor manufacturing.