Company Filing History:
Years Active: 1999-2000
Title: Chi-Hua Yang: Innovator in Semiconductor Technology
Introduction
Chi-Hua Yang is a notable inventor based in Yorktown, NY (US). He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on advanced processes for thin film sputtering and etching techniques that enhance the performance of solid-state devices.
Latest Patents
Chi-Hua Yang's latest patents include a high throughput A1-Cu thin film sputtering process on small contact vias. This innovative method involves a two-step sputtering process that optimizes the deposition of aluminum-copper films at varying temperatures and powers. The first step ensures good coverage in the via hole, while the second step reduces processing time. Another significant patent addresses the etching of high aspect contact holes in solid-state devices. This process utilizes a polysilicon mask to form contact holes through a dielectric, allowing for precise interconnections in semiconductor devices.
Career Highlights
Throughout his career, Chi-Hua Yang has worked with prominent companies such as IBM and Siemens Aktiengesellschaft. His experience in these leading organizations has allowed him to develop and refine his innovative techniques in semiconductor manufacturing.
Collaborations
Chi-Hua Yang has collaborated with esteemed colleagues, including Tomio Katata and Hideaki Aochi. These partnerships have contributed to the advancement of technology in the semiconductor industry.
Conclusion
Chi-Hua Yang's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of advanced manufacturing processes for solid-state devices.