Skokie, IL, United States of America

Chi-Haur Wu


Average Co-Inventor Count = 2.2

ph-index = 3

Forward Citations = 87(Granted Patents)


Company Filing History:


Years Active: 2001-2006

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4 patents (USPTO):Explore Patents

Title: Chi-Haur Wu: Innovator in Manufacturing and Assembly Technologies

Introduction

Chi-Haur Wu is a notable inventor based in Skokie, IL (US). He has made significant contributions to the fields of manufacturing and assembly technologies. With a total of 4 patents, his work reflects a deep understanding of product fabrication and component manipulation.

Latest Patents

Wu's latest patents include a "Manufacturing and De-fabrication Analysis Method and Apparatus." This invention introduces a structured product coding system that captures both the components used in fabrication and the manipulators that execute part-mating operations. This system generates a generic assembly/disassembly tree corresponding to the product. Another significant patent is the "Heated Nozzle Assembly," which features an interface block that allows for quick electrical connections to high-speed machines for picking and placing electronic components. This assembly can be easily plugged into and removed from a high-speed placement machine, enhancing efficiency in manufacturing processes.

Career Highlights

Throughout his career, Chi-Haur Wu has worked with prestigious institutions such as Northwestern University and Academia Sinica. His experience in these organizations has allowed him to develop innovative solutions that address complex manufacturing challenges.

Collaborations

Wu has collaborated with several talented individuals, including Der-Tsai Lee and Swee Mean Mok, who is a prominent woman in the field. Their collective expertise has contributed to advancements in manufacturing technologies.

Conclusion

Chi-Haur Wu's contributions to manufacturing and assembly technologies through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively.

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