This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Infineon Technologies Ag. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chew Yeek Lau: Innovator in Semiconductor Technology
Introduction
Chew Yeek Lau is a prominent inventor based in Muar, Malaysia. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to flip chip bonding.
Latest Patents
Chew Yeek Lau holds a patent for a method titled "Flip chip bonding for semiconductor packages using metal strip." This method involves mounting semiconductor dies on a metal strip in a flip chip arrangement. The terminals of the semiconductor dies face the upper surface of the metal strip, which is then encapsulated with an electrically insulating material. The package terminals are formed from the metal strip or from metal deposited after its removal, ensuring efficient electrical connections.
Career Highlights
Chew Yeek Lau is associated with Infineon Technologies AG, a leading company in semiconductor solutions. His work has been instrumental in advancing the technology used in semiconductor packaging, which is crucial for the performance and reliability of electronic devices.
Collaborations
He has collaborated with notable colleagues, including Fong Mei Lum and Kon Hoe Chin, contributing to various projects within the semiconductor industry.
Conclusion
Chew Yeek Lau's innovative work in semiconductor technology exemplifies the impact of dedicated inventors in advancing modern electronics. His contributions continue to influence the industry and pave the way for future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile