Chew Ching Lim

Title: Chew Ching Lim: Innovator in Integrated Circuit Packaging

Introduction

Chew Ching Lim is a notable inventor based in Sungai Petani, Malaysia. He has made significant contributions to the field of integrated circuit packaging, holding a total of 2 patents. His work focuses on innovative solutions that enhance the performance and reliability of electronic components.

Latest Patents

Chew Ching Lim's latest patents include a "Package substrate warpage reshaping apparatus and method" and an "Integrated circuit package with solderless interconnection structure." The warpage reshaping apparatus is designed to reshape the warpage profile of a package substrate. It consists of a metal boat with multiple cavities, planar boards, and spring-loaded clips that ensure each planar board is pressed against its respective package substrate. This innovative design allows for effective reshaping of warpage profiles, improving the overall quality of the package substrates.

The integrated circuit package patent describes a structure that includes an integrated circuit die and a package substrate with a conductive pad. A conductive pillar is formed on the front surface of the integrated circuit die, which directly contacts the conductive pad. This design allows for efficient alignment and connection between the conductive pillar and the conductive pad, enhancing the functionality of the integrated circuit package.

Career Highlights

Chew Ching Lim is currently employed at Altera Corporation, where he continues to develop cutting-edge technologies in the field of integrated circuits. His work has been instrumental in advancing the capabilities of electronic packaging solutions.

Collaborations

Throughout his career, Chew has collaborated with talented individuals such as Tze Yang Hin and Loon Kwang Tan. These collaborations have fostered innovation and contributed to the successful development of his patented technologies.

Conclusion

Chew Ching Lim is a distinguished inventor whose work in integrated circuit packaging has led to significant advancements in the industry. His innovative patents reflect his commitment to improving electronic component performance and reliability.