Hopewell Junction, NY, United States of America

Chet Dziobkowski

This inventor holds 1 USPTO granted patent. Top assignees: Infineon Technologies Ag, International Business Machines Corporation. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chet Dziobkowski. Retrieved from https://idiyas.com/inventor/chet-dziobkowski

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 10.0

ph-index = 1


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Chet Dziobkowski: Innovator in Microelectronics

Introduction

Chet Dziobkowski is a notable inventor based in Hopewell Junction, NY (US). He has made significant contributions to the field of microelectronics, particularly in the area of metallization structures.

Latest Patents

Chet holds a patent for a method titled "Low Cu percentages for reducing shorts in AlCu lines." This innovation focuses on improving the fabrication of metallization structures during the formation of microelectronic devices. The method aims to reduce metal shorts in blanket metal deposition layers that are later subjected to reactive ion etching. He has 1 patent to his name.

Career Highlights

Throughout his career, Chet has worked with prominent companies in the technology sector. Notably, he has been associated with Infineon Technologies AG and IBM. His work in these organizations has contributed to advancements in microelectronic technologies.

Collaborations

Chet has collaborated with several professionals in his field, including Roy Charles Iggulden and Padraic C. Shafer. These collaborations have further enriched his contributions to microelectronics.

Conclusion

Chet Dziobkowski's innovative work in microelectronics, particularly his patented methods, showcases his expertise and commitment to advancing technology. His collaborations and career highlights reflect his significant impact in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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