Cheow Khoon Oh

Title: Cheow Khoon Oh: Innovator in Wafer Level Chip Scale Packaging

Introduction

Cheow Khoon Oh is a prominent inventor based in Singapore, known for his contributions to semiconductor packaging technology. With a total of five patents to his name, he has made significant advancements in the field of wafer level chip scale packages (WLCSP).

Latest Patents

His latest patent focuses on a wafer level chip scale package structure and its manufacturing method. This innovative WLCSP structure includes a semiconductor die and a stack that consists of a protective tape and a molding compound. A unique feature of this design is that a portion of the first interface surface between the molding compound and the protective tape is curved. The manufacturing method involves several steps, including forming a semiconductor structure, attaching it to a dummy wafer, and performing a two-step dicing process with different cutting tools. The curvature of the interface surface is designed to minimize the risk of cracks in the WLCSP structure, enhancing its reliability and performance.

Career Highlights

Cheow has worked with notable companies in the semiconductor industry, including Alpha and Omega Semiconductor (Cayman) Ltd. and Alpha & Omega Semiconductor Corporation. His experience in these organizations has contributed to his expertise in semiconductor technologies and innovations.

Collaborations

Throughout his career, Cheow has collaborated with talented individuals such as Zhiqiang Niu and Bum-Seok Suh, who have also made significant contributions to the field.

Conclusion

Cheow Khoon Oh's work in wafer level chip scale packaging exemplifies the innovative spirit of the semiconductor industry. His patents and collaborations reflect a commitment to advancing technology and improving product reliability.