Shenzhen, China

Chengya Xiong

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignees: Te Connectivity Corporation, Tyco Electronics (Shanghai) Co., Ltd.. Active years: 2020.


% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Chengya Xiong: Innovator in Load Transfer Mechanisms

Introduction

Chengya Xiong is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of load transfer mechanisms, particularly with his innovative designs that enhance the efficiency of weigh-in-motion systems. His work is characterized by a blend of engineering expertise and practical application.

Latest Patents

Chengya Xiong holds a patent for a "Load transfer mechanism for weigh in motion." This invention includes an elongated beam and a sensing package. The beam features a plate with a load-bearing surface, a tube portion, and a neck. The tube portion consists of a base wall and a cover, defining a cavity between them. The sensing package is strategically placed within the cavity and is designed to measure forces exerted on the load-bearing surface of the plate. This innovative mechanism is crucial for accurate weight measurements in motion.

Career Highlights

Throughout his career, Chengya Xiong has worked with prominent companies such as Tyco Electronics (Shanghai) Co., Ltd. and Te Connectivity Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various projects that focus on advanced technology and innovation.

Collaborations

Chengya has collaborated with talented individuals in his field, including Shenghua Liu and Michael Pedrick. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Chengya Xiong is a distinguished inventor whose work in load transfer mechanisms has made a significant impact in the industry. His innovative designs and collaborations continue to push the boundaries of technology and engineering.

Profile summary based on public USPTO records.
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