This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Siliconware Precision Industries, Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Innovations of Cheng-You Jeng in Electronic Packaging
Introduction
Cheng-You Jeng is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, particularly through his innovative patent. His work focuses on enhancing the performance and reliability of electronic devices.
Latest Patents
Cheng-You Jeng holds a patent for an "Electronic package and manufacturing method thereof." This invention involves a unique design where a cover is placed on a carrier structure that houses an electronic element. A magnetic conductive member is strategically positioned between the cover and the electronic element, creating an air gap that improves the shielding effect of the electronic package. This innovation is crucial for protecting sensitive electronic components from external interference.
Career Highlights
Cheng-You Jeng is associated with Siliconware Precision Industries, Ltd., a leading company in the semiconductor packaging industry. His role at the company has allowed him to apply his inventive skills to real-world applications, contributing to advancements in electronic packaging technologies.
Collaborations
Cheng-You Jeng has collaborated with talented coworkers, including Wen-Jung Tsai and Chih-Hsien Chiu. Their combined expertise has fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Cheng-You Jeng's contributions to electronic packaging through his patent demonstrate his commitment to innovation in the field. His work not only enhances the functionality of electronic devices but also sets a standard for future developments in the industry.