Cheng-Yih Liu

Title: Innovations of Cheng-Yih Liu

Introduction

Cheng-Yih Liu is a prominent inventor based in Woodbridge, VA (US). She has made significant contributions to the field of technology, particularly in the area of fabrication methods and polymer science. With a total of six patents to her name, Liu has demonstrated her expertise and innovative spirit.

Latest Patents

One of her latest patents is a fabrication method for controlled via hole processes. This method involves forming via holes with a rounded sidewall profile by exposing a layer of organic positive photoresist to a formic gas plasma. During this process, the surface of the photoresist layer is bombarded with ions and electrons in a high voltage biased environment, where the photoresist layer is capacitively coupled. Additionally, the photoresist layer may be exposed to UV light either before or after the formic gas plasma step. Another notable patent is for the preparation of continuous films of diacetylenic polymers. In this process, continuous films are formed on a substrate by coating it with a solution of a diacetylenic prepolymer in a liquid phenylacetylene solvent, followed by a reaction between the solvent and the prepolymer.

Career Highlights

Cheng-Yih Liu is currently employed at International Business Machines Corporation (IBM), where she continues to push the boundaries of innovation. Her work has not only advanced her career but has also contributed to the technological landscape.

Collaborations

Throughout her career, Liu has collaborated with notable colleagues, including Ronald P Esch and Robert M Folsom. These collaborations have further enriched her work and expanded her impact in the field.

Conclusion

Cheng-Yih Liu is a remarkable inventor whose contributions to technology and innovation are noteworthy. Her patents reflect her dedication to advancing fabrication methods and polymer science. Liu's work continues to inspire future generations of inventors and innovators.