Cheng-Yi Weng

Title: Cheng-Yi Weng: Innovator in Semiconductor Packaging

Introduction

Cheng-Yi Weng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and solutions. His work is particularly recognized for its impact on the efficiency and reliability of semiconductor devices.

Latest Patents

Cheng-Yi Weng holds a patent for a semiconductor package that includes a first chip, an insulating protection layer, a second chip, a plurality of second conductive bumps, and an underfill. The insulating protection layer is strategically placed on the first active surface of the first chip and features a concave design. Projections of a plurality of first inner pads and a plurality of first outer pads of the first chip are located in and out of the concave, respectively. The second chip is flipped onto the concave and includes a plurality of second pads. Each of the first inner pads is electrically connected to the corresponding second pad through the corresponding second conductive bump. The underfill is positioned between the concave and the second chip, covering the second conductive bumps. This innovative design enhances the performance and durability of semiconductor packages.

Career Highlights

Cheng-Yi Weng is currently employed at Chipmos Technologies Inc., where he continues to develop cutting-edge semiconductor technologies. His work at Chipmos has allowed him to collaborate with other talented professionals in the field, further advancing the company's mission to deliver high-quality semiconductor solutions.

Collaborations

Cheng-Yi Weng has worked closely with his coworker, Cheng-Yu Yang, to drive innovation and improve semiconductor packaging technologies. Their collaboration has led to advancements that benefit the industry as a whole.

Conclusion

Cheng-Yi Weng is a prominent figure in the semiconductor industry, with a focus on innovative packaging solutions. His contributions, particularly through his patent, demonstrate his commitment to enhancing technology in this vital field. His work continues to influence the development of reliable and efficient semiconductor devices.