Cheng-Yen Liu

Title: Innovations of Cheng-Yen Liu in Microelectromechanical Systems

Introduction

Cheng-Yen Liu is a notable inventor based in Munich, Germany. He has made significant contributions to the field of microelectromechanical systems (MEMS), particularly in the development of advanced microphone technologies. With a total of 2 patents to his name, Liu's work showcases his expertise and innovative spirit.

Latest Patents

Liu's latest patents include a microelectromechanical microphone with membrane trench reinforcements and a method of fabrication. This MEMS microphone features a flexible plate and a rigid plate that are mechanically coupled. The design incorporates a stoppage member affixed to the rigid plate, which limits the motion of the flexible plate. The rigid plate also includes a reverse bending edge with specific corner radii, enhancing the microphone's performance. Another patent focuses on a microelectromechanical microphone that is robust against substantial pressure changes. This device includes a substrate with an opening for pressure waves, a flexible plate that deforms in response to these waves, and a rigid plate with multiple openings for wave passage.

Career Highlights

Throughout his career, Cheng-Yen Liu has worked with prominent companies such as TDK Corporation and TDK Electronics AG. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technologies in the MEMS field.

Collaborations

Liu has collaborated with notable professionals in his field, including Kurt Rasmussen and Dennis Mortensen. These partnerships have further enriched his work and expanded the impact of his innovations.

Conclusion

Cheng-Yen Liu's contributions to microelectromechanical systems highlight his innovative approach and technical expertise. His patents reflect a commitment to advancing microphone technology, making him a significant figure in the field.