The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2022

Filed:

Feb. 16, 2021
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Pirmin Rombach, Munich, DE;

Kurt Rasmussen, Munich, DE;

Dennis Mortensen, Munich, DE;

Cheng-Yen Liu, Munich, DE;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/08 (2006.01);
U.S. Cl.
CPC ...
H04R 1/08 (2013.01); H04R 2201/003 (2013.01);
Abstract

Technologies are provided for microelectromechanical microphones that can be robust to substantial pressure changes in the environment in which the micromechanical microphones operate. In some embodiments, a microelectromechanical microphone device can include a substrate defining a first opening to receive a pressure wave. The microelectromechanical microphone device also can include a flexible plate mechanically coupled to the substrate and a rigid plate mechanically coupled to the flexible plate. The flexible plate is deformable by the pressure wave. The rigid plate defines multiple openings that permit passage of the pressure wave. The microelectromechanical microphone device can further include at least one stoppage member assembled in a spatial relationship with the flexible plate. The at least one stoppage member can limit motion of the flexible plate in response to the pressure wave including a threshold amplitude.


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