Cheng Xu

Title: Cheng Xu: Innovator in Semiconductor Packaging

Introduction

Cheng Xu is a notable inventor based in Suzhou, China. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative designs aimed at reducing warpage in plastic package wafers. His work is characterized by a focus on enhancing the reliability and performance of semiconductor devices.

Latest Patents

Cheng Xu holds a patent for a "Package structure for reducing warpage of plastic package wafer and method for manufacturing the same." This invention includes a package structure that features an adapter board, a chip mounted on the adapter board, and a first plastic package layer covering the chip. The design incorporates through-silicon vias on the adapter board, with external connection solder balls and/or pads that are electrically connected to these vias. The manufacturing process involves bonding a carrier to the adapter board, cutting it to expose the chip-mounting area, and completing the package through subsequent processes.

Career Highlights

Throughout his career, Cheng Xu has worked with prominent companies in the semiconductor industry. He has been associated with Shanghai Xianfeng Semiconductor Co., Ltd and the National Center for Advanced Packaging Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in packaging technology.

Collaborations

Cheng has collaborated with notable colleagues, including Liqiang Cao and Fei Geng. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas in the field of semiconductor packaging.

Conclusion

Cheng Xu's contributions to semiconductor packaging through his innovative patent and collaborative efforts highlight his role as a key figure in the industry. His work continues to influence advancements in technology, ensuring the reliability and efficiency of semiconductor devices.