Taipei, Taiwan

Cheng-Wen Hsieh

This inventor holds 68 USPTO granted patents and 27 published patent applications and 13 EPO patents, primarily in Heat Dissipation Technology (CPC class F04D). Top assignees: Acer Inc., Acer Incorported. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng-Wen Hsieh. Retrieved from https://idiyas.com/inventor/cheng-wen-hsieh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 68 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.9

ph-index = 4

Forward Citations = 98(Granted Patents)

Forward Citations (Not Self Cited) = 77(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:


Years Active: 2016-2026

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Areas of Expertise:
Heat Dissipation System
Centrifugal Fan
Thermal Module
Portable Electronic Device
Vapor Chamber
Graphics Card
Cycling Heat Module
Axial-Flow Fan
Fan Structure
Heat-Dissipation Unit
Electronic Device Cooling
Thermal Dissipation
68 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Cheng-Wen Hsieh Revolutionizing Heat Dissipation in Portable Electronic Devices

Introduction:

Cheng-Wen Hsieh, a prolific inventor hailing from New Taipei, Taiwan, is making waves in the world of technology with his groundbreaking inventions in the field of heat dissipation systems for portable electronic devices. With an impressive portfolio of 54 patents to his name, Cheng-Wen Hsieh's innovative designs are reshaping the way electronic devices manage heat to ensure optimal performance and longevity.

Latest Patents:

Among his latest patents is the 'Heat dissipation system of portable electronic device,' a cutting-edge system that incorporates a centrifugal fan and spacing member to create a stratified air flow for enhanced cooling efficiency. Additionally, the 'Vapor chamber structure' designed by Cheng-Wen Hsieh offers an advanced solution for heat dissipation by utilizing a unique housing and capillary structure filled with a working fluid to efficiently dissipate heat from the source.

Career Highlights:

Cheng-Wen Hsieh's exceptional career is highlighted by his tenure at Acer Inc., a renowned technology company known for its innovative products and solutions. As a key member of the research and development team at Acer Inc., Cheng-Wen Hsieh has played a pivotal role in driving forward technological advancements in thermal management systems for electronic devices.

Collaborations:

Throughout his career, Cheng-Wen Hsieh has collaborated closely with esteemed colleagues such as Wen-Neng Liao and Jau-Han Ke, who have contributed their expertise to the development of cutting-edge heat dissipation technologies. Together, they have pushed the boundaries of innovation in the field of thermal management, setting new standards for performance and efficiency in electronic devices.

Conclusion:

In conclusion, Cheng-Wen Hsieh's innovative work in the realm of heat dissipation systems is reshaping the landscape of portable electronic devices, ensuring optimal performance and reliability for users worldwide. His relentless pursuit of excellence and commitment to pushing the boundaries of technological innovation make him a true pioneer in the field. We look forward to witnessing more revolutionary inventions from Cheng-Wen Hsieh as he continues to transform the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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