Cheng Ting Wu

Title: Innovations of Cheng Ting Wu in IC Packaging

Introduction

Cheng Ting Wu is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of integrated circuit (IC) packaging. His innovative approach has led to advancements that simplify the structure of IC packages, ultimately reducing costs.

Latest Patents

Cheng Ting Wu holds a patent for an IC package that reduces wiring layers on the substrate and its carrier. This patent describes an IC package that primarily includes a chip, a plurality of electrical connecting components, and a chip carrier. The substrate features a top surface and a bottom surface, with the top surface containing a die-attaching area for the die-attaching layer. The chip is attached to this area and is electrically connected to the substrate through the electrical connecting components. The design incorporates bonding wires that are bonded to interconnecting fingers on the substrate's top surface, with portions of the bonding wire encapsulated in the die-attaching layer. This innovative design eliminates the need for some conventional wirings or vias, resulting in a simpler substrate structure and reduced costs.

Career Highlights

Cheng Ting Wu is currently employed at Chipmos Technologies Inc., where he continues to work on advancements in IC packaging technology. His expertise and innovative mindset have positioned him as a valuable asset in the field.

Collaborations

Cheng Ting Wu has collaborated with notable colleagues, including Hung Tsun Lin and Wu Chang Tu. Their combined efforts contribute to the ongoing development of cutting-edge technologies in the industry.

Conclusion

Cheng Ting Wu's contributions to IC packaging through his innovative patent demonstrate his commitment to advancing technology in this field. His work not only simplifies the design of IC packages but also helps in reducing costs, showcasing the importance of innovation in the electronics industry.