Cheng-Shiu Hsiao

Title: Cheng-Shiu Hsiao: Innovator in Packaging Technology

Introduction

Cheng-Shiu Hsiao is a notable inventor based in Nantou, Taiwan. He has made significant contributions to the field of packaging technology, particularly in the development of advanced semiconductor packaging solutions. With a total of 2 patents, Hsiao's work has had a considerable impact on the industry.

Latest Patents

One of Hsiao's latest patents is a stacked-die package structure. This innovative design comprises a carrier, dies, spacers, adhesive layers, conductive lines, a mold compound, and solder balls. The carrier features an upper surface and a back surface opposite to the upper surface. The dies, which are substantially the same size, are stacked on the upper surface of the carrier, with bonding pads located around each die. Spacers are positioned between adjacent dies, and adhesive layers are used to adhere the layers together. Conductive lines connect the bonding pads of the dies to the carrier, while a mold compound encapsulates the entire assembly. This structure is suitable for use with a substrate that has solder balls or a lead frame with pins.

Another significant patent by Hsiao is for a quad flat non-leaded package structure designed for housing CMOS sensors. This package includes a die pad, multiple leads, a die, bonding wires, a packaging plastic body, and a lid cover. Supporters are formed near the edges on the backside of the die pad, and the leads are positioned at a defined distance from the die pad. The packaging plastic body is formed on the upper surface near the peripheral section of the leads, while the space between the die pad and the leads is filled with packaging plastic material. The die is attached to the die pad and connected to the leads using bonding wires, with the lid cover placed over the packaging body.

Career Highlights

Cheng-Shiu Hsiao is currently employed at Siliconware Precision Industries Co., Ltd., where he continues to innovate in the field of semiconductor packaging. His work has been instrumental in advancing the technology used in modern electronic devices.

Collaborations

Hsiao has collaborated with notable coworkers, including Chin-Yuan Hung and Lien-Chen Chiang, contributing to various projects and innovations within the company.

Conclusion

Cheng-Shiu Hsiao's contributions to packaging technology have established