Cheng-Ping Lin

Title: Cheng-Ping Lin: Innovator in Semiconductor Packaging Technology

Introduction

Cheng-Ping Lin is a prominent inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor packaging technology. With a total of 5 patents to his name, Lin's work has advanced the methods and structures used in the manufacturing of integrated circuits.

Latest Patents

Lin's latest patents include innovative methods for manufacturing package structures. One notable patent describes a method that involves forming a passivation layer with an opening and creating a first seed layer within that opening. The process continues with filling the opening with a conductive layer over the first seed layer and bonding an integrated circuit die to this conductive layer. Additionally, the method outlines the removal of a portion of the first seed layer to expose the top surface of the conductive layer and partially reveal a first sidewall of the passivation layer. Another patent focuses on the package structure itself, which includes an integrated circuit die surrounded by a package layer, along with a redistribution structure that is electrically connected to the die.

Career Highlights

Cheng-Ping Lin is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in developing advanced packaging solutions that enhance the performance and reliability of integrated circuits.

Collaborations

Lin has collaborated with notable colleagues, including Yi-Da Tsai and Chih-Wei Lin, to further innovate in the field of semiconductor technology. Their combined expertise has contributed to the successful development of new packaging methods and structures.

Conclusion

Cheng-Ping Lin's contributions to semiconductor packaging technology are noteworthy and impactful. His innovative patents and collaborations with fellow experts continue to shape the future of integrated circuit manufacturing.