Company Filing History:
Years Active: 2011
Title: Cheng-Pin Chien: Innovator in Package Substrate Structures
Introduction
Cheng-Pin Chien is an inventor based in Shulin City, Taiwan. He has made significant contributions to the field of package substrate structures, focusing on innovative designs and methods. Although he currently holds no granted patents, his work is noteworthy for its potential impact on the industry.
Latest Patent Applications
Cheng-Pin Chien's latest patent application is titled "PACKAGE SUBSTRATE STRUCTURE WITH CAVITY AND METHOD FOR MAKING THE SAME." This application describes a package substrate structure that includes a substrate with a first side and a second side opposite to the first side. It features a via connecting the first side and the second side, a cavity in the substrate on the first side, and a patterned conductive layer disposed on at least one of the first side and the second side. This layer fills the cavity and the via, comprising a first conductive layer, a second conductive layer, and a third conductive layer. Notably, the second conductive layer differs from at least one of the first and third conductive layers.
Conclusion
Cheng-Pin Chien's innovative approach to package substrate structures showcases his potential as an inventor in the field. His latest patent application reflects his commitment to advancing technology in this area.