Unimicron Technology Corporation

Cheng-Pin Chien

Tsung-Yuan Chen

Kuo-Ching Chen

A method of making a package substrate includes providing a cladding sheet comprising a first metal layer, a second metal layer and an intermediate layer between the first and second metal layers; etching away a portion of the first metal layer to expose a portion of the intermediate layer thereby forming a metal island body; laminating a first copper clad on the cladding sheet comprising a first copper foil and a first insulating layer; patterning the first copper foil to form a first circuit trace; patterning the second metal layer to form a second circuit trace; removing the metal island body to form a cavity in the first insulating layer; and removing the intermediate layer from bottom of the cavity.

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Shulin, Taiwan

Cheng-Pin Chien