Cheng-hung Yeh

Title: Cheng-hung Yeh: Innovator in Package Structure Technology

Introduction

Cheng-hung Yeh is a notable inventor based in Miaoli, Taiwan. He has made significant contributions to the field of semiconductor packaging technology. His innovative approach has led to the development of a unique package structure that enhances the efficiency and functionality of electronic devices.

Latest Patents

Cheng-hung Yeh holds a patent for a "Package structure and method for forming the same." This patent describes a comprehensive package structure that includes a die, a first molding surrounding the die, a first redistribution layer (RDL), and an interposer disposed over the first RDL. The design also features a second molding surrounding the interposer, a first via, and a second RDL. The first RDL consists of a first dielectric layer and a first interconnect structure that is electrically connected to the die. The interposer is linked to the die through this interconnect structure, while the second RDL includes a second dielectric layer and a second interconnect structure that connects to the via and the interposer. This innovative package structure is crucial for advancing semiconductor technology.

Career Highlights

Cheng-hung Yeh is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this prestigious company has allowed him to collaborate with other experts and contribute to groundbreaking advancements in semiconductor packaging.

Conclusion

Cheng-hung Yeh's contributions to the field of semiconductor packaging through his innovative patent demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and pave the way for future innovations.