Cheng-Hsiung Yang

Title: Cheng-Hsiung Yang: Innovator in Circuit Technology

Introduction

Cheng-Hsiung Yang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of circuit technology, holding a total of 5 patents. His work focuses on enhancing the functionality and reliability of electronic components.

Latest Patents

One of his latest patents is titled "Substrate bonding pad having a multi-surface trace interface." This invention involves a bonding pad designed for a ball grid array, which includes a conductive pad with a top surface and a first interface surface that contacts a signal trace of a substrate. The plating layer in this design features protrusions that extend toward the signal trace, ensuring that the connection remains secure and uncompromised.

Another significant patent is "Printed circuit board trace for galvanic effect reduction." This patent describes methods for minimizing etching caused by galvanic effects within printed circuit boards, particularly in data storage devices. The design includes a contact trace coupled to a larger contact finger, which is plated with a common material to reduce galvanic etching during fabrication.

Career Highlights

Cheng-Hsiung Yang has worked with prominent companies in the technology sector, including Kinsus Interconnect Technology Corporation and Western Digital Technologies, Inc. His experience in these organizations has allowed him to develop innovative solutions that address critical challenges in circuit design and manufacturing.

Collaborations

Throughout his career, Cheng-Hsiung has collaborated with talented individuals such as Chih-Chin Liao and Chia-Chi Lo. These partnerships have contributed to the advancement of technology in their respective fields.

Conclusion

Cheng-Hsiung Yang is a distinguished inventor whose work in circuit technology has led to several important patents. His innovative designs continue to influence the industry and enhance the performance of electronic devices.