Cheng-Hsiao Lin

Title: Innovations by Cheng-Hsiao Lin in Circuit Board Fabrication

Introduction

Cheng-Hsiao Lin is an innovative inventor based in Taoyuan, Taiwan. With a strong focus on advancing technology in circuit board fabrication, he holds a patent that showcases his expertise in this vital area of electronics. His contributions have significantly impacted the manufacturing processes and efficiency in the industry.

Latest Patents

Cheng-Hsiao Lin has been granted one patent, titled "Fabrication Method of Circuit Board." This innovative method involves drilling holes in a substrate to create multiple first and second opening holes. Following this, a cover film is attached to the substrate, covering these holes. The procedure includes selectively removing portions of the cover film to expose the first opening holes, which are then filled to enhance the functionality and reliability of the circuit boards.

Career Highlights

Cheng-Hsiao Lin works at Gold Circuit Electronics Ltd., a company recognized for its commitment to quality and innovation in circuit board production. His role at the company allows him to apply his innovative techniques and contribute to the ongoing advancements in the field.

Collaborations

Throughout his career, Cheng-Hsiao Lin has collaborated with talented coworkers such as Chih-Hai Yu and Kuo-Wei Lo. These partnerships have enabled him to exchange ideas and develop more effective and efficient manufacturing methods within the circuit board industry.

Conclusion

Cheng-Hsiao Lin's contributions to circuit board fabrication through his patented method illustrate the importance of innovation in the technology sector. As the demand for more sophisticated electronic components grows, inventors like Lin play a crucial role in shaping the future of technology and electronics manufacturing.