The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2020
Filed:
Aug. 17, 2017
Applicant:
Gold Circuit Electronics Ltd., Taoyuan, TW;
Inventors:
Assignee:
Gold Circuit Electronics Ltd., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 3/12 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0094 (2013.01); H05K 3/0026 (2013.01); H05K 3/0055 (2013.01); H05K 3/0079 (2013.01); H05K 3/064 (2013.01); H05K 3/067 (2013.01); H05K 3/125 (2013.01); H05K 3/1208 (2013.01); H05K 3/4053 (2013.01); H05K 3/4644 (2013.01); H05K 1/115 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/09827 (2013.01); H05K 2203/054 (2013.01); H05K 2203/085 (2013.01); H05K 2203/107 (2013.01); Y10T 29/49165 (2015.01);
Abstract
A fabrication method of a circuit includes drilling holes in a substrate, so as to form a plurality of first opening holes and second opening holes in the substrate. A cover film is attached onto the substrate, so as to cover the first opening holes and the second opening holes. A portion of the cover film covering the first opening holes is removed, so as to expose the first opening holes. The first opening holes are filled.