Taichung, Taiwan

Cheng-Gang Fu

This inventor holds 1 USPTO granted patent. Top assignee: Winbond Electronics Corporation. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng-Gang Fu. Retrieved from https://idiyas.com/inventor/cheng-gang-fu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Cheng-Gang Fu: Innovator in Drying Block Structures

Introduction

Cheng-Gang Fu is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of drying technologies. His innovative approach has led to the development of a unique drying block structure that enhances storage efficiency.

Latest Patents

Cheng-Gang Fu holds a patent for a "Drying block structure and storage device." This invention features a main body with a honeycomb and substantially circular shape. The protective layer, which has a porous structure, covers the main body. Notably, both the main body and the protective layer are integrally formed as one piece. This design aims to improve the drying process and storage capabilities.

Career Highlights

Cheng-Gang Fu is associated with Winbond Electronics Corporation, where he applies his expertise in innovative technologies. His work has been instrumental in advancing the company's product offerings. With a focus on practical applications, he continues to push the boundaries of what is possible in his field.

Collaborations

Cheng-Gang Fu collaborates with talented individuals such as Bo-Ren Chi and Tze-Ching Chuang. Their combined efforts contribute to the success of their projects and innovations.

Conclusion

Cheng-Gang Fu's contributions to drying technologies exemplify the spirit of innovation. His patent and collaborative efforts highlight the importance of teamwork in achieving groundbreaking advancements. His work continues to inspire future developments in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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