Company Filing History:
Years Active: 2005
Title: Innovations in Multi-Chip Packaging: The Contributions of Cheng-Fen Chen
Introduction: Cheng-Fen Chen, an accomplished inventor based in Kaohsiung, Taiwan, has made notable contributions to the field of semiconductor technology. With a focus on enhancing multi-chip packaging, he has secured one patent that showcases his innovative approach to electrical interconnection in semiconductor assemblies.
Latest Patents: Cheng-Fen Chen holds a patent for a "Multi-chip package with electrical interconnection." This invention encompasses a sophisticated design that features a leadframe, relay conductors, multiple chips, bonding wires, and a molding compound. The technology involves a dielectric carrier securely attached to the leadframe, facilitating the positioning of the relay conductor. The innovation allows for the electrical interconnection of chips through bonding wires that connect to a common lead via the relay conductor, ultimately reducing costs while improving efficiency.
Career Highlights: Cheng-Fen Chen is affiliated with Advanced Semiconductor Engineering, Inc., a leading company in semiconductor packaging and testing. His work has significantly contributed to the progress of multi-chip integration, benefiting industries reliant on advanced electronic systems.
Collaborations: Throughout his tenure, Cheng-Fen Chen has collaborated with notable professionals, including Bau-Nan Lee and Chih-Wei Tsai. Together, they have pooled their expertise to push the boundaries of semiconductor innovations.
Conclusion: Cheng-Fen Chen's work exemplifies a commitment to advancing semiconductor technology through his innovative inventions. His contributions, particularly in the realm of multi-chip packages, reflect the potential for continued growth and improvement in the electronics sector.