The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2005
Filed:
May. 05, 2004
Bau-nan Lee, Pingtung, TW;
Cheng-fen Chen, Kaohsiung, TW;
Chih-wei Tsai, Tainan, TW;
Chih-pin Hung, Kaohsiung, TW;
Bau-Nan Lee, Pingtung, TW;
Cheng-Fen Chen, Kaohsiung, TW;
Chih-Wei Tsai, Tainan, TW;
Chih-Pin Hung, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A multi-chip package with electrical interconnection comprises a leadframe, at least a relay conductor, at least a first chip, at least a second chip, a plurality of bonding wires and a molding compound. A dielectric carrier is attached to the leadframe for fixing the relay conductor. The relay conductor has a top surface for interconnection of the bonding wires and a bottom surface attached to the dielectric carrier to electrically isolated from the leadframe. The bonding wires electrically connect the bonding pads of the first chip and second chip to the common lead of the leadframe through the relay conductor so as to achieve electrical interconnection of the plurality of chips and the leadframe inside the molding compound with lower cost.