Cheng-En Ho

Title: Innovations by Cheng-En Ho in Solder Joint Technology.

Introduction

Cheng-En Ho is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of solder joint technology, particularly in controlling the formation of intermetallic compounds.

Latest Patents

Cheng-En Ho holds a patent titled "Method for controlling the formation of intermetallic compounds in solder joints." This invention addresses the control of intermetallic compounds between SnAgCu solders and Ni-bearing substrates. By adjusting the copper concentration in SnAgCu solders, the types of intermetallic compounds can be effectively managed. Specifically, if the copper concentration is higher than or equal to 0.6 wt. %, the soldering intermetallic compound includes a continuous (Cu Ni) Sn layer. Conversely, if the concentration is lower than or equal to 0.4 wt. %, the compound consists of a continuous (Ni Cu) Sn layer and a non-continuous (Cu Ni) Sn layer. For concentrations between 0.4 wt. % and 0.6 wt. %, the compound includes the continuous (Cu Ni) Sn.

Career Highlights

Cheng-En Ho is affiliated with National Central University, where he continues to advance research in solder joint technology. His work has implications for various industries that rely on reliable solder joints in electronic components.

Collaborations

Cheng-En Ho collaborates with fellow researcher Cheng-Heng Kao, contributing to advancements in their field.

Conclusion

Cheng-En Ho's innovative methods for controlling intermetallic compounds in solder joints represent a significant advancement in materials science. His contributions are vital for improving the reliability of electronic components.